Silicon doping for laser splash blockage

ABSTRACT

Semiconductor devices having silicon doping for laser splash protection, along with associated methods and systems, are disclosed herein. In one embodiment, a semiconductor device includes a silicon layer and a circuitry layer with a plurality of semiconductor devices. A doped silicon region is formed on a front side of the silicon layer upon which the circuitry layer is deposited. The doped silicon region is positioned under the circuitry layer. The doped silicon region has a dopant concentration of at least 1015 cm−3.

TECHNICAL FIELD

The present technology generally relates to doping to facilitate theseparation of semiconductor devices into individual units and, moreparticularly, relates to silicon doping of semiconductor wafers toprotect the circuitry during the dicing process.

BACKGROUND

A semiconductor device may include a plurality of semiconductor devicesformed on a single substrate. Each semiconductor device on the singlesubstrate generally comprises of a circuitry layer positioned on asilicon layer. For example, a semiconductor wafer may be processed toform a plurality of dies from a single semiconductor wafer. A topsurface of the semiconductor wafer includes the circuitry layer (e.g.,plurality of dies) and a bottom surface includes the silicon layer(e.g., substrate).

Various processes may be used to separate the semiconductor device intoa plurality of semiconductor devices. One of these processes is stealthdicing. Stealth dicing is performed before the grinding of the backsideof the semiconductor device and eventual separation of the semiconductordevice into a plurality of semiconductor devices. The semiconductordevice, e.g., a wafer, is initially treated using laser dicing at aspecified depth in the silicon layer. The emitted radiation from thelaser severs a portion of the silicon lattice of the silicon layer atspecific points, creating partial regions. These partial cuts constitutefracture regions created from laser irradiation in the silicon layer.Fracture regions are created throughout the silicon layer in a patternaround the plurality of semiconductor devices. The plurality ofsemiconductor devices, e.g., wafer, may then be thinned to a targetthickness. Under mechanical stress, the thinned plurality ofsemiconductor devices separates into individual units along the fractureregions.

One disadvantage of stealth dicing is that the radiating laser maydamage the circuitry layer. To effectively separate semiconductordevices using stealth dicing, a higher laser energy is needed. But ahigh-energy laser has the potential to damage sensitive circuitry.Furthermore, high energy lasers produce unwanted scattering when focusedat a particular point on the silicon material. This scattering of thehigh energy laser may reach the circuitry layer of the semiconductordevice, causing damage to the sensitive circuitry. This unwantedscattering may be referred to as laser splashes. Damaged semiconductorcircuitry from laser splashes often results in the disposal of thesemiconductor device, premature failure, and other quality assurancerisks.

Thus, an efficient way to prevent laser splash or unwanted scatteringfrom a high energy laser from reaching the circuitry layer of asemiconductor device is needed.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present technology can be better understood withreference to the following drawings. The components in the drawings arenot necessarily to scale. Instead, emphasis is placed on illustratingclearly the principles of the present technology.

FIG. 1 shows a semiconductor device with a silicon layer and a circuitrylayer undergoing stealth dicing according to one exemplary embodiment.

FIG. 2 shows another semiconductor device with a damaged silicon latticenear the fracture regions due to laser splash.

FIG. 3 shows an improved semiconductor device with a silicon layer, adoped silicon layer, and a circuitry layer undergoing stealth dicingaccording to one exemplary embodiment.

FIG. 4 shows a graph of the transmission of light as a percentage versuswavelength for various samples of silicon.

FIG. 5A shows a graph of the absorption coefficient versus p-dopantdensity for a wavelength of 1064 nm.

FIG. 5B shows a graph of the absorption coefficient versus n-dopantdensity for a wavelength of 1064 nm.

FIG. 6 shows a laser performing stealth dicing on another improvedsemiconductor device according to one exemplary embodiment.

FIG. 7 shows a lateral view of a laser performing stealth dicing onanother improved semiconductor device to create fracture regionsaccording to one exemplary embodiment.

FIG. 8 shows another semiconductor device containing fracture regions inthe silicon lattice with no laser splash damage.

FIG. 9 shows a method of doping a silicon layer according to oneexemplary embodiment.

FIG. 10A shows an interstitial diffusion mechanism illustrating themotion of a dopant atom from a first position to a second positionaccording to one exemplary embodiment.

FIG. 10B shows a substitutional diffusion mechanism illustrating themotion of a dopant atom from a first position to a second positionaccording to one exemplary embodiment.

FIG. 11 shows a laser performing stealth dicing on a plurality ofsemiconductor devices according to one exemplary embodiment.

The various embodiments are illustrated by way of example, and not byway of limitation, in the figures of the accompanying drawings. Moreparticular descriptions and equally effective implementations areincluded in this disclosure.

Identical reference numerals have been used, where possible, todesignate identical elements that are common to the figures. It iscontemplated that elements disclosed in one implementation may bebeneficially utilized in other implementations without specificrecitation.

DETAILED DESCRIPTION

Following the detailed description, reference is made to theaccompanying drawings that form specific embodiments by way ofillustration in which the disclosed subject matter can be practiced.However, it should be understood that other embodiments may be utilized,and structural changes may be made without departing from the scope ofthe disclosed subject matter. Any combination of the following featuresand elements is contemplated to implement and practice the disclosure.

In the description, common or similar features may be designated bycommon reference numbers. As used herein, “exemplary” may indicate anexample, an implementation, or an aspect, and should not be construed aslimiting or as indicating a preference or a preferred implementation.

Specific details of several embodiments of semiconductor devices, andassociated systems and methods, are described below. The term“substrate” can refer to a wafer-level substrate or to a singulated,die-level substrate. Furthermore, unless the context indicatesotherwise, structures disclosed herein can be formed using conventionalsemiconductor-manufacturing techniques. Materials can be deposited, forexample, using chemical vapor deposition, physical vapor deposition,atomic layer deposition, plating, electroless plating, spin coating,and/or other suitable techniques. Similarly, materials can be removed,for example, using plasma etching, wet etching, chemical-mechanicalplanarization, or other suitable techniques. A person skilled in therelevant art will also understand that the technology may haveadditional embodiments, and that the technology may be practiced withoutseveral of the details of the embodiments described below with referenceto FIGS. 1-11.

Numerous specific details are disclosed herein to provide a thorough andenabling description of embodiments of the present technology. A personskilled in the art, however, will understand that the technology mayhave additional embodiments and that the technology may be practicedwithout several of the details of the embodiments described below withreference to FIGS. 1-11. For example, some details of semiconductordevices and/or packages well known in the art have been omitted so asnot to obscure the present technology. In general, it should beunderstood that various other devices and systems in addition to thosespecific embodiments disclosed herein may be within the scope of thepresent technology.

The term “semiconductor device” can refer to an assembly of one or moresemiconductor devices, semiconductor device packages, and/or substrates,which may include interposers, supports, and/or other suitablesubstrates. The semiconductor device assembly may be manufactured as,but not limited to, discrete package form, strip or matrix form, and/orwafer panel form. The term “semiconductor device” generally refers to asolid-state device that includes a semiconductor material. Asemiconductor device can include, for example, a semiconductorsubstrate, wafer, panel, or a single die from a wafer or substrate. Asemiconductor device may refer herein to a semiconductor wafer, butsemiconductor devices are not limited to semiconductor wafers.

As used herein, the terms “vertical,” “lateral,” “upper,” “lower,”“above,” and “below” can refer to relative directions or positions offeatures in the semiconductor devices in view of the orientation shownin the Figures. For example, “upper” or “uppermost” can refer to afeature positioned closer to the top of a page than another feature.These terms, however, should be construed broadly to includesemiconductor devices having other orientations, such as inverted orinclined orientations where top/bottom, over/under, above/below,up/down, and left/right can be interchanged depending on theorientation.

FIG. 1 shows a semiconductor device with a silicon layer and a circuitrylayer undergoing stealth dicing according to one exemplary embodiment.Semiconductor device 100 includes silicon layer 110 and circuitry layer120. Silicon layer 110 includes the backside surface 112 of thesemiconductor device. Circuitry layer 120 is positioned on silicon layer110. Circuitry layer 120 includes the front surface 122 of thesemiconductor device. Incoming laser beam 150 is directed towardssemiconductor device 100 with a focal point 152 at a point on siliconlayer 110. Incoming laser beam 150 irradiates the silicon lattice ofsilicon layer 110 to create fracture region 160. Incoming laser beam 150produces laser splash 154 within the semiconductor device 100.

Silicon layer 110 may have a first thickness and circuitry layer 120 mayhave a second thickness with the first thickness being greater than thesecond thickness. In one embodiment, the first thickness is less thanfive times larger than the second thickness. In one embodiment, thefirst thickness may be approximately 22 microns and the second thicknessmay be approximately 6 microns. In one embodiment, the first thicknessmay be less than nine times as large as the second thickness.

Silicon layer 110 can be a “blank” substrate that does not includeintegrated circuit components and that is formed from, for example,crystalline, semi-crystalline, and/or ceramic substrate materials, suchas silicon, polysilicon, aluminum oxide (Al2O3), sapphire, and/or othersuitable materials. Silicon layer 110 may also include a siliconsubstrate, a gallium arsenide substrate, or an organic laminatesubstrate.

Silicon layer 110 may be a wafer including a plurality of semiconductordevices. The thickness of the wafer may range from 20 micrometers to 300micrometers or more. Stealth dicing may be performed on a wafer withoutthe bottom half cut. Silicon layer 110 may include materials with asmall relative dielectric constant relative to silicon dioxide (low-K)or may include a high relative dielectric constant relative to silicondioxide (non-low-K).

Circuitry layer 120 includes at least one semiconductor device. In someembodiments, circuitry layer is a wafer including a plurality ofsemiconductor devices. These semiconductor devices may be separated intoindividual units. A thin, non-functional spacing separates thefunctional parts of the circuitry between each of the plurality ofsemiconductor devices. This spacing may be called a scribe line or a sawstreet. The scribe line may range from anywhere between 20 micrometerswide to 110 micrometers wide. A scribe line with a width of 60micrometers or less may undergo stealth dicing without the backside halfcut. A scribe line with a width of 60 micrometers or more may undergostealth dicing with the backside half cut.

Incoming laser beam 150 creates fracture regions (i.e., grooving orscoring) beneath the scribe line, resulting in a clean separationbetween the dies when silicon layer 110 is mechanically stressed. Asdiscussed herein, the fracture regions in the circuitry layer by thelaser ablation do not penetrate the entire thickness of the circuitrylayer.

Circuitry layer 120 is generally sensitive to static discharge and highenergy devices. Damaged semiconductor circuitry often results in thedisposal of the semiconductor device or its premature failure. Circuitrylayer 120 is also susceptible to chipping or cracking both before andafter separation of the plurality of semiconductor devices. Chipping orcracking may be caused by stress to the silicon layer, especially duringthe dicing or singulation process. Incoming laser beam 150 must avoidcontact with circuitry layer 120. In some embodiments, a seal ring isplaced between the scribe line and the circuitry. Incoming laser beam150 and any laser splash 154 must not go beyond the seal ring.

Circuitry layer 120 includes the front surface 122 of the semiconductordevice. The front surface 122 can be an active side including one ormore circuit elements (e.g., wires, traces, interconnects, transistors,etc.; shown schematically) formed in and/or on the top surface 122. Thecircuit elements can include, for example, memory circuits (e.g.,dynamic random memory (DRAM) or other type of memory circuits),controller circuits (e.g., DRAM controller circuits), logic circuits,and/or other circuits.

Incoming laser beam 150 is capable of lasing semiconductor device 100.In particular, incoming laser beam 150 is capable of lasing the siliconlayer 110. The incoming laser beam 150 is focused at or beneath thebackside surface 112. The irradiation of the silicon layer 110 by theincoming laser beam 150 causes a portion of the silicon lattice to becleaved, resulting in the fracture region 160. As discussed herein, theincoming laser beam 150 may irradiate the silicon layer 110 in apattern. The pattern may run along the boundaries of the plurality ofsemiconductor devices. In some embodiments, the pattern follows thescribe lines between the plurality of dies on a semiconductor wafer. Insome embodiments, the doped region 330 is formed along the patternbetween the boundaries of the plurality of semiconductor devices.

The incoming laser beam 150 may have an infrared wavelength. In at leastone embodiment, the wavelength of incoming laser beam 150 is 1342 nm.

Laser splash 154 is unwanted scattering from incoming laser beam 150. Insome cases, silicon layer 110 may not be capable of absorbing all theenergy concentrated at focal point 152. Generally, the silicon layerwill absorb about 70% of the energy from incoming laser beam 150.Unabsorbed energy scatters or deflects to areas other than focal point152. Laser splash 154 may damage the surrounding areas near the focalpoint 152. In some cases, laser splash 154 may pass through the siliconlayer 110, damaging the circuitry layer 120. Damaged circuitry layer 120from laser splash often results in the disposal of the semiconductordevice, premature failure, and other quality assurance risks.

Fracture region 160 is created by the incoming laser beam 150. Theincoming laser beam 150 may be focused substantially within the siliconlayer 110. In one embodiment, fracture region 160 is created in thesilicon layer adjacent to the circuitry layer 120. In anotherembodiment, fracture region 160 is created the lower half of the siliconlayer closest to the circuitry layer 120. Fracture region 160 may becreated before grinding the backside of the silicon layer 110.

The irradiation of the silicon layer 110 by the incoming laser beam 150causes a portion of the silicon lattice of the silicon layer to becleaved. As discussed herein, the incoming laser beam 150 may irradiatethe silicon layer 110 in a pattern. The pattern is along the boundariesof the plurality of semiconductor devices. In some embodiments, thepattern follows the scribe lines between the plurality of dies on asemiconductor wafer. In some embodiments, the doped region 330 is formedalong the pattern between the boundaries of the plurality ofsemiconductor devices.

Generally, fracture region 160 is created by the incoming laser beam 150passing through the backside surface 112 of semiconductor device. Insome embodiments, the incoming laser beam 150 passes through the frontsurface 122 of the semiconductor device to create fracture region 160.

FIG. 2 shows an image of a semiconductor device with a damaged siliconlattice near the fracture regions due to laser splash. The damagedsilicon lattice is located within silicon layer 110. The incoming laserbeam 150 has created a series of cleavages, or fracture regions runningthrough the silicon layer 110. As illustrated, laser splash 154 hascaused damage to the silicon lattice 110. The damage to silicon latticeextends beyond the readily identifiable dark areas surrounding theseries of cleavages. In some cases, the laser splash 154 damages thecircuitry layer 120.

FIG. 3 shows an improved semiconductor device with a silicon layer, adoped silicon layer, and a circuitry layer undergoing stealth dicingaccording to one exemplary embodiment. Semiconductor device 200 includessilicon layer 110, circuitry layer 120, and doped region 330. Circuitrylayer 120 is positioned over doped region 330, which is positioned oversilicon layer 110. Circuitry layer 120 includes of the front surface 122of the semiconductor device. Silicon layer 110 includes the backsidesurface 112 of semiconductor device. Incoming laser beam 150 is directedtowards semiconductor device 100 with a focal point at 152. Incominglaser beam 150 irradiates the silicon lattice of silicon layer 110 tocreate fracture region 160. Incoming laser beam 150 produces lasersplash 154 within the semiconductor device 100. Laser splash 154 isdeflected or absorbed by doped region 330.

Doped region 330 is positioned between the silicon layer 110 and thecircuitry layer 120. Doped region 330 is proximate to circuitry layer120. Doped region 330 is created on the side of the silicon layer 110upon which the circuitry layer 120 is deposited. In at least oneembodiment, doped region 330 abuts the circuitry layer 120. Doped region330 is created in silicon layer 110 before the deposition of circuitrylayer 120 on silicon layer 110 in some embodiments. The doped region 330may be selectively formed on the side of the silicon layer 110 uponwhich the circuitry layer 120 is deposited.

Doped region 330 is created by the silicon layer 110 absorbing certainimpurities. In one embodiment, the impurity is boron. The resultingcompounds include boron tribromide, boron trioxide, diborane, borontrichloride, and boron nitride. In other embodiments, the impurities areantimony, arsenic, and phosphorous. The resulting compounds includeantimony trioxide, arsenic trioxide, arsine, phosphorous oxychloride,phosphorous pentoxide, and phosphine.

Doped region 230 is a protective layer against optic aberration. Theincoming laser beam 150 may not converge at one focal point because oflimitations or defects in the optics of the laser. As a result, lasersplash 154 from the light beam may strike the silicon layer 110 at apoint dangerously close to the active circuitry 220. The silicon layer110 may not be able to absorb the stray light. The doped region 330shields the active circuitry by deflecting and absorbing laser splash154.

Doped region 330 is capable of deflecting laser splash 154. The dopingin doped region 230 changes the optic properties of the silicon layer110. The amount of impurities introduced into the doped region 330changes the index of refraction. The higher the dopant concentration,the higher the index of refraction of doped region 330. Changing theindex of refraction deflects laser splash 154 away from the surface ofthe doped region 330.

Doped region 330 is capable of absorbing laser splash 154. The doping indoped region 230 changes the absorptive properties of the silicon layer110. The amount of impurities introduced into the doped region 330changes the transmission of light through the doped region 330 in someembodiments. The higher the dopant concentration, the less light thatpasses through doped region 330. Increasing the dopant concentration indoped region 330 results in more absorption of laser splash 154 by thedoped region 330. Laser splash 154 will not traverse the doped region330 to reach the circuitry layer 120 with high dopant concentration.Thus, laser splash impingement on the circuitry layer 120 is avoided.

FIG. 4 shows a graph of the transmission of light as a percentage versuswavelength for various samples of silicon. Laser splash 154 may beabsorbed by doped region 230. As illustrated in the graph, a higherdopant concentration results in a lower percentage of lighttransmission.

FIG. 5A shows a graph of the absorption coefficient versus p-dopantdensity for a wavelength of 1064 nm. In some embodiments, the p-dopantdensity is at least 10¹⁵ cm⁻³. The p-dopant density is 10¹⁸ cm⁻³ in atleast one embodiment.

FIG. 5B shows a graph of the absorption coefficient versus n-dopantdensity for a wavelength of 1064 nm. In some embodiments, the n-dopantdensity is at least 10¹⁵ cm⁻³. The n-dopant density is 10¹⁸ cm⁻³ in atleast one embodiment.

FIG. 6 shows is a laser performing stealth dicing on another improvedsemiconductor device according to one exemplary embodiment. Laser 300includes laser source 610 and laser optics 620. Laser source 610 passesa light beam through laser optics 620 to focus on an area within thesilicon layer. The focused laser beam 630 may be adjusted by laseroptics 620, displacing the irradiated location in the silicon layer 110.

Laser source 610 generates a high energy laser beam capable of cleavingthe silicon lattice to create fracture region 160. The laser source maygenerate a laser beam having a wavelength between 1000 nm and 1400 nm.In one embodiment, the laser source generates a laser beam having awavelength of 1342 nm.

Focused laser beam 630 has the ability to focus at a particular depth insilicon layer 110. The laser 600 may utilize multiphoton absorption inorder to form a modified region within the silicon layer 110. A materialbecomes optically transparent if its absorption bandgap E is greaterthan a photon energy hV. The condition under which absorption occurs inthe material is hVE. However, the material yields absorption under thecondition of nhv>E where n=2,3,4 even when the material is opticallytransparent.

Focused laser beam 630 may emit pulse waves. In the case of pulse waves,the intensity of laser light is determined by the peak power density(W/cm) of laser light at a light-converging point thereof. Themultiphoton absorption occurs, for example, at a peak power density(W/cm) of 1×10 (W/cm) or higher. The peak power density is determined by(energy per pulse of laser light at the light-converging point)/(laserlight beam spot cross-sectional area x pulse width). In the case of acontinuous wave, the intensity of laser light is determined by theelectric field strength (W/cm) of laser light at the light-convergingpoint.

Laser splash 154 may be triggered by a variety of failure mechanisms ofthe laser itself. For instance, laser splash may be the result of anoff-centered laser beam. Machines generating a laser beam without an LBAcentering function tend to cause this failure mode. In other cases, anunoptimized stealth dicing recipe may cause sporadic laser splash 154.Creating an optimized recipe may require several trials to get theoptimized wafer yield. Optimized recipes may also require frequentcalibration of the machine. In at least one embodiment, laser splash wascontrolled at a power setting of 0.7 W.

Laser machine conditions vary such that an unoptimized condition couldpotentially cause laser splash 154 in the future. Even optimized recipescould see early signs of failure by laser splash 154 if pushed tolarge-scale manufacturing or processing extremes. Thus, optimizedrecipes and conditions may be insufficient to prevent circuitry damageresulting from laser splash 154

Laser optics 320 may adjust the laser beam source 310 to focus atvarious depths within the silicon layer 110. Laser optics 320 may focuslaser beam source 310 in a plurality of locations. For example, laseroptics 320 may produce two focal points within silicon layer 110 tofacilitate simultaneous multipoint processing of the silicon layer 110.This method is advantageous with thicker wafers.

FIG. 7 shows a lateral view of a laser performing stealth dicing on animproved semiconductor device to create fracture regions according toone exemplary embodiment. Laser source 610 passes a light beam throughlaser optics 620 to focus on an area within the silicon layer 110. Thefocused laser beam 630 may be adjusted by laser optics 620, displacingthe irradiated location in the silicon layer 110. The focused laser beam630 created a series of cleavages or multiple fracture regions 760 insilicon layer 110.

The focused laser beam 630 may irradiate the silicon layer in a pattern.The pattern may run along the boundaries of the plurality ofsemiconductor devices. In some embodiments, the pattern follows thescribe lines between the plurality of dies on a semiconductor wafer. Insome embodiments, the doped region 330 is formed along the patternbetween the boundaries of the plurality of semiconductor devices.

Multiple fracture regions 760 run along a separation line within thesilicon layer 110. The focused laser beam 630 creates multiple fractureregions 360 along the separation line, corresponding to where thesemiconductor device will be divided. The separation line may be formedin the scribe line or saw street between the plurality of semiconductordevices. After the desired separation lines have been formed, theportions of the wafer can be separated with any suitable method, such astape expansion or cracking by bending.

Multiple fracture regions 760 are created by the focused laser beam 630entering through the backside surface 112 of the semiconductor device.In at least one embodiment, the multiple fracture regions 760 may becreated by the focused laser beam 630 entering through the front surface122 of the semiconductor device. In at least one embodiment, themultiple fracture regions 760 are created by the focused laser beam 630entering through both the backside surface 112 and the front surface 122of the semiconductor device.

Doped region 330 may be continuous as depicted. Doped region 330 may beselectively formed beneath multiple fracture regions 760. In at leastone embodiment, doped region 330 is selectively formed underneath theplurality of semiconductor devices. Doped region 330 may be selectivelyformed across an entire wafer except beneath the scribe lines.

FIG. 8 shows another semiconductor device containing multiple fractureregions in the silicon lattice with no laser splash damage.

FIG. 9 shows a method of doping a silicon layer according to oneexemplary embodiment. Doped region 330 may be created by thermaldiffusion. Thermal diffusion is a two-step process comprising ofdeposition (introducing dopant atoms at the wafer surface) and drive-in(dopant atoms diffuse into the wafer to create the requiredconcentration).

The type of dopant determines the delivery method for deposition. For aliquid source, a carrier gas is usually used to transport the vapors tothe diffusion furnace. For solid sources, wafer-sized slugs are packedinto the furnace along with the product wafers. Another option is tospin on the oxide source on the wafer surface using a suitable solvent.A solid source may be vaporized in a neighboring furnace and to use acarrier gas to transport the vapors to the wafer. A mask may be appliedto designate the desired regions of doping.

Once the dopant atoms have arrived on the wafer surface, they need to beredistributed into the bulk silicon. The drive-in process can either becarried out through substitutional diffusion or interstitial diffusion.FIG. 10A shows an interstitial diffusion mechanism illustrating themotion of dopant atom from a first position to a second positionaccording to one exemplary embodiment. Interstitial diffusion is carriedout when the dopant atom is smaller than the silicon atom. Rapid thermalprocession may be applied to the wafer to cultivate interstitialdiffusion until the desired concentration of impurities is reached.

FIG. 10B shows a substitutional diffusion mechanism illustrating themotion of dopant atom from a first position to a second positionaccording to one exemplary embodiment. Substitutional diffusion occurswhen the dopant size is comparable to the silicon atom. Rapid thermalprocession may be applied to the wafer to cultivate substitutionaldiffusion until the desired concentration of impurities is reached.

FIG. 11 shows a laser performing stealth dicing on a plurality ofsemiconductor devices according to one exemplary embodiment. Theplurality of semiconductor devices may be semiconductor wafer 1110.Semiconductor wafer 1110 includes a pattern across the surface. Thelaser ablation of the silicon layer may be done in grid pattern 1112.That is, the silicon lattice is cleaved along grid pattern 1112 latticein order to separate the semiconductor wafer into individualsemiconductor devices or dies.

Doped region 330 may be formed corresponding to the grid pattern 1112.Each doped region 330 may correlate to a semiconductor device or die. Insome embodiments, the doped region is beneath the semiconductor deviceor die. The doped region 330 may be absent along scribe lines in thegrid pattern. In some embodiments, the doped region 330 is formed alongthe pattern between the boundaries of the plurality of semiconductordevices.

The doped region 330 may be created in the areas most susceptible tolaser splash 154. For instance, the doped region 330 is formed in thesurrounding areas or borders of the scribe lines 1114. The method ofcreating doped region 330 may place masks correlating to areas lesssusceptible to laser splash 154 and open exposure for dopant diffusionin areas more susceptible to laser splash 154.

Any of the semiconductor devices having the features described abovewith reference to FIGS. 1-11 can be incorporated into any of a myriad oflarger and/or more complex systems. The system can include a processor,a memory (e.g., SRAM, DRAM, flash, and/or other memory devices),input/output devices, and/or other subsystems or components. Theresulting system can be configured to perform any of a wide variety ofsuitable computing, processing, storage, sensing, imaging, and/or otherfunctions. Accordingly, representative examples of the system include,without limitation, computers and/or other data processors, such asdesktop computers, laptop computers, Internet appliances, hand-helddevices (e.g., palm-top computers, wearable computers, cellular ormobile phones, personal digital assistants, music players, etc.),tablets, multi-processor systems, processor-based or programmableconsumer electronics, network computers, and minicomputers. Additionalrepresentative examples of the system include lights, cameras, vehicles,etc. With regard to these and other examples, the system can be housedin a single unit or distributed over multiple interconnected units,e.g., through a communication network. The components of the system canaccordingly include local and/or remote memory storage devices and anyof a wide variety of suitable computer-readable media.

From the foregoing, it will be appreciated that specific embodiments ofthe technology have been described herein for purposes of illustration,but that various modifications may be made without deviating from thedisclosure. Accordingly, the invention is not limited except as by theappended claims. Furthermore, certain aspects of the new technologydescribed in the context of particular embodiments may also be combinedor eliminated in other embodiments. Moreover, although advantagesassociated with certain embodiments of the new technology have beendescribed in the context of those embodiments, other embodiments mayalso exhibit such advantages, and not all embodiments need necessarilyexhibit such advantages to fall within the scope of the technology.Accordingly, the disclosure and associated technology can encompassother embodiments not expressly shown or described herein.

While this patent document contains many specifics, these should not beconstrued as limitations on the scope of any invention or of what may beclaimed, but rather as descriptions of features that may be specific toparticular embodiments of particular inventions. Certain features thatare described in this patent document in the context of separateembodiments can also be implemented in combination in a singleembodiment. Conversely, various features that are described in thecontext of a single embodiment can also be implemented in multipleembodiments separately or in any suitable subcombination. Moreover,although features may be described above as acting in certaincombinations and even initially claimed as such, one or more featuresfrom a claimed combination can in some cases be excised from thecombination, and the claimed combination may be directed to asubcombination or variation of a subcombination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. Moreover, the separation of various system components in theembodiments described in this patent document should not be understoodas requiring such separation in all embodiments.

Only a few implementations and examples are described, and otherimplementations, enhancements and variations can be made based on whatis described and illustrated in this patent document.

The illustrations of embodiments described herein are intended toprovide a general understanding of the structure of various embodiments,and they are not intended to serve as a complete description of all theelements and features of components and systems that might make use ofthe structures described herein. Many other embodiments will be apparentto those of ordinary skill in the art upon reviewing the descriptionprovided herein. Other embodiments may be utilized and derived, suchthat structural and logical substitutions and changes may be madewithout departing from the scope of this disclosure. The figures hereinare merely representational and may not be drawn to scale. Certainproportions thereof may be exaggerated, while others may be minimized.Accordingly, the specification and drawings are to be regarded in anillustrative rather than a restrictive sense.

Some embodiments implement functions in two or more specificinterconnected hardware modules or devices with related control and datasignals communicated between and through the modules, or as portions ofan application-specific integrated circuit. Thus, the example system isapplicable to software, firmware, and hardware implementations.

The abstract of the disclosure is provided to allow the reader toquickly ascertain the nature of the technical disclosure. It issubmitted with the understanding that it will not be used to interpretor limit the scope or meaning of the claims. In addition, in theforegoing detailed description, it can be seen that various features aregrouped together in a single embodiment for the purpose of streamliningthe disclosure. This method of disclosure is not to be interpreted asreflecting an intention that the claimed embodiments require morefeatures than are expressly recited in each claim. Rather, as thefollowing claims reflect, inventive subject matter lies in less than allfeatures of a single disclosed embodiment. Thus, the following claimsare hereby incorporated into the detailed description, with each claimstanding on its own as a separate embodiment.

While the foregoing is directed to implementations of the presentdisclosure, other and further implementations of the disclosure may bedevised without departing from the basic scope thereof, and the scopethereof is determined by the claims that follow.

I claim:
 1. A method of dicing a silicon substrate, the method comprising: applying a mask to a front side of the silicon substrate, wherein the mask includes one or more openings exposing one or more regions to be doped; introducing dopant atoms at the one or more regions; diffusing the dopant atoms into the one or more regions using a rapid thermal procession until the one or more regions have a dopant concentration of at least 10 ¹⁵ cm⁻³; forming an active layer of circuitry at the front side of the substrate; stealth dicing the substrate from a back surface thereof using laser irradiation to cleave one or more portions of a silicon lattice of the substrate, the one or more portions being vertically aligned with the one or more regions; and back-grinding the back surface of the substrate to mechanically separate adjacent semiconductor dice from the substrate on opposing sides of the one or cleaved more portions of the silicon lattice of the substrate, wherein the dopant concentration of the one or more regions is configured to absorb a laser splash from the stealth dicing or to reflect the laser splash away from the active layer of circuitry.
 2. The method of claim 1, wherein the mask aligns with scribe lines between a plurality of semiconductor devices of a circuitry layer.
 3. The method of claim 1, wherein the mask aligns with a plurality of semiconductor devices of a circuitry layer.
 4. The method of claim 1, wherein the mask is only applied to a surrounding border adjacent to a plurality of scribe lines.
 5. The method of claim 1, wherein the dopant concentration comprises boron impurities.
 6. The method of claim 1, wherein the dopant concentration comprises phosphorous impurities.
 7. The method of claim 1, wherein the dopant concentration is based on a desired index of refraction for the doped silicon region.
 8. The method of claim 1, wherein the dopant concentration is based on a desired light transmissivity for the doped silicon region.
 9. The method of claim 1, wherein the dopant concentration is based on an ability of the doped silicon region absorb a laser splash containing a wavelength of about 1000-1342 nm. 